Validating Medical Device Packaging

Developing and Validating a New Wireless Wearable Device for Balance Measurement in Sport and Clinical Setting

One of the new clinical techniques to assess the lower body parameters is the wearable ultrasonic sensors. The device which can measure the static and dynamic balance abilities in sport and clinical setting by the traveled signals of ultrasonic transmitter and receiver between two feet was developed and validated. The new device consisted of a pressure gauge and a digital centimeter indicator a...

Technology Advances and Challenges in Hermetic Packaging for Implantable Medical Devices

Many implantable medical devices contain sophisticated electronic circuits. Hermetic packaging is required to provide the implant’s electronic circuitry with protection from the harsh environment of the human body. This chapter provides a review of available hermetic sealing methods and their applications. General considerations of implantable medical device packaging are discussed. Various tes...

Corrosion Resistance of Pb-Free and Novel Nano-Composite Solders in Electronic Packaging

A Systems Approach to Solder Joint Fatigue in Spacecraft Electronic Packaging

Jet Propulsion Laboratory California Institute of Technology Pasadena, CA 91109 Differential expansion induced fatigue resulting from temperature cycling is a leading cause of solder joint failures in spacecraft. Achieving high reliability flight hardware requires that each element of the fatigue issue be addressed carefully. This includes defining the complete thermal-cycle environment to be e...

Survey Report of Current Status of High Temperature Micro devices Packaging

Wide band-gap semiconductor materials such silicon carbide (SiC), gallium nitride (GaN), and diamond (C) based electronic devices may operate at temperatures above the high temperature limit of silicon technology. Among these wide band gap materials, single crystal SiC is the most mature material at this stage. SiC has such excellent physical and chemical material properties that SiC microsyste...